A fully MMIC transceiver module for 5 GHz wireless communications

Author

Ogawa, T. ; Kyu, I. ; Kondoh, H. ; Takatani, S.

Author_Institution

Central Res. Lab., Hitachi Ltd., Tokyo, Japan

fYear

2001

fDate

21-24 Oct. 2001

Firstpage

33

Lastpage

36

Abstract

A fully MMIC 5 GHz-band transceiver module has been developed, which demonstrated high-speed modulation capability of 48 Mbps OFDM/64QAM with 5-7% error vector magnitude (EVM) for 5-6 GHz operations. The module is assembled on a multi-layer ceramic substrate with land grid type RF/DC terminals and measures 11.0/spl times/13.75/spl times/1.1 mm/sup 3/. The module incorporates four MMIC chips operating from /spl plusmn/3 V power supplies and supports a wide range of IF frequencies from 200 MHz to 1.8 GHz.

Keywords

MMIC; OFDM modulation; ceramic packaging; integrated circuit measurement; integrated circuit packaging; mobile radio; modules; quadrature amplitude modulation; transceivers; 1.1 mm; 11 mm; 13.75 mm; 200 MHz to 1.8 GHz; 3 V; 48 Mbit/s; 5 to 6 GHz; EVM; IF frequencies; MMIC chips; MMIC transceiver module; OFDM; QAM; error vector magnitude; high-speed modulation capability; land grid type RF/DC terminals; module assembly; multi-layer ceramic substrate; power supplies; wireless communications; Ceramics; MMICs; OFDM; Power supplies; Radio frequency; Semiconductor device measurement; Switches; Transceivers; Wireless LAN; Wireless communication;

fLanguage

English

Publisher

ieee

Conference_Titel

Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 2001. 23rd Annual Technical Digest

Conference_Location

Baltimore, MD, USA

ISSN

1064-7775

Print_ISBN

0-7803-6663-8

Type

conf

DOI

10.1109/GAAS.2001.964339

Filename

964339