• DocumentCode
    1864602
  • Title

    CMOS/BiCMOS power amplifier technology trend in Japan

  • Author

    Suematsu, N. ; Shinjo, S.

  • Author_Institution
    Inf. R&D Center, Mitsubishi Electr. Corp., Kanagawa, Japan
  • fYear
    2001
  • fDate
    21-24 Oct. 2001
  • Firstpage
    107
  • Lastpage
    110
  • Abstract
    Aiming for 2-5GHz band transceiver system on a chip, the integration of RF section has been developed by using conventional CMOS/BiCMOS (SiGeCMOS) process. The attempts to integrate power amplifiers (PA´s) have been successful for low transmit power system such as Bluetooth, but these attempts are very limited due to the poor power handling capability of FET´s in CMOS and the distortion characteristics of BJT´s(HBT´s) in BiCMOS. From the point of view of a circuit designer, this paper reviews the recent research activities of CMOS/BiCMOS PA´s in Japan, and also describes the details of (1) the feasibility study of PA´s using conventional CMOS process, and (2) the circuitry trials of distortion reduction for BJT(HBT) PA´s.
  • Keywords
    BiCMOS analogue integrated circuits; CMOS analogue integrated circuits; UHF integrated circuits; UHF power amplifiers; electric distortion; transceivers; 2 to 5 GHz; BJT; BiCMOS power amplifier; Bluetooth; CMOS power amplifier; FET; HBT; Japan; RF IC technology; SiGe; circuit design; distortion characteristics; transceiver chip; wireless communication; BiCMOS integrated circuits; Bluetooth; CMOS process; CMOS technology; FETs; Power amplifiers; Power systems; Radio frequency; Radiofrequency amplifiers; Transceivers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 2001. 23rd Annual Technical Digest
  • Conference_Location
    Baltimore, MD, USA
  • ISSN
    1064-7775
  • Print_ISBN
    0-7803-6663-8
  • Type

    conf

  • DOI
    10.1109/GAAS.2001.964357
  • Filename
    964357