Title :
Over-40-Gb/s IC module technology using 8-mm-square leadless chip carrier packages mounted on four-layer resin printed circuit boards
Author :
Sugahara, H. ; Kimura, S. ; Murata, K. ; Sano, E.
Author_Institution :
NTT Photonics Labs., Kanagawa, Japan
Abstract :
A key technology for realizing small, low-cost IC modules for over-40-Gb/s optical communication systems has been developed. The technology mainly features 8-mm-square leadless chip carrier (LCC) packages and four-layer resin printed circuit boards (PCBs). It was applied to build a prototype multichip 1:4 DEMUX module operating at 45 Gb/s.
Keywords :
demultiplexing equipment; integrated circuit packaging; multichip modules; optical communication equipment; printed circuit manufacture; 45 Gbit/s; 8 mm; IC module technology; four-layer resin printed circuit board; leadless chip carrier package; multichip DEMUX module; optical communication system; Conducting materials; Integrated circuit packaging; Optical fiber communication; Photonic integrated circuits; Printed circuits; Prototypes; Resins; Semiconductor device measurement; Thermal conductivity; Thermal resistance;
Conference_Titel :
Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 2001. 23rd Annual Technical Digest
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
0-7803-6663-8
DOI :
10.1109/GAAS.2001.964389
