Title :
A technique to investigate the root cause of Write Recovery Time (tWR) failure
Author :
Chen Chien-Fu ; Chang Hung-Jia ; Hsiao Mei-Ying ; Peng Sheng-Hsiu ; Lin Yi-Min
Author_Institution :
Reliability & Failure Anal. Dept., Powerchip Technol. Corp., Hsinchu, Taiwan
fDate :
June 29 2015-July 2 2015
Abstract :
We developed a technique to investigate the root cause of Write Recovery Time (tWR) failure on Circuit Probing for 30nm DRAM. We take Electrical Failure Analysis (EFA) to probe the Drain current (Id) and detected the unbalanced between forward Drain-Source currents (Ids, forward) and reverse Drain-Source currents (Ids, reverse) on device because the shadowing effect from Lightly Doped Drain (LDD) processing induced Id lower. The result of the EFA and Physical Failure Analysis (PFA) are good agreement with the assumption. We also found the Y Center of Gravity (YCOG) parameter vs. Drain current (Id) has highly relation and YCOG parameter raiser will induced Id current lower. We discovered that measuring of forward and reverse Drain-Source currents (Ids) would be useful to quickly and easily detect the unbalance of the implant dose issue.
Keywords :
DRAM chips; failure analysis; integrated circuit testing; DRAM; EFA; LDD; PFA; Y center of gravity; YCOG; circuit probing; drain-source currents; electrical failure analysis; lightly doped drain; physical failure analysis; size 30 nm; tWR failure; write recovery time failure; Decision support systems; Drain-Source currents (Ids); Lightly Doped Drain (LDD); Write Recovery Time (tWR); Y Center of Gravity (YCOG); shadowing effect;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location :
Hsinchu
DOI :
10.1109/IPFA.2015.7224322