DocumentCode
1867693
Title
Debugging MBIST hard fails without bitmapping
Author
Yeoh, B.L. ; Goh, S.H. ; You, G.F. ; Hao, Hu ; Sio, W.L. ; Lam, Jeffrey
Author_Institution
Technol. Dev., Product Test & Failure Anal., GLOBALFOUNDRIES, Singapore, Singapore
fYear
2015
fDate
June 29 2015-July 2 2015
Firstpage
138
Lastpage
143
Abstract
Embedded memories modules are one of the core components in System-on-a-Chip (SoC) device. For memory built-in self-test (MBIST) failures, bitmapping tool is normally used to locate the defect location. This paper demonstrates the effectiveness in the use of dynamic photon emission microscopy (PEM) analysis as an alternative method to debug MBIST failures. We also show how an additional failure characterization step prior to fault localization, can enhance success rate and turnaround time.
Keywords
built-in self test; failure analysis; system-on-chip; SoC; debugging MBIST hard fails; dynamic photon emission microscopy; embedded memories modules; failure characterization; fault localization; memory built-in self-test failures; system-on-a-chip; Inspection; Metals; Modulation; Photonics; SRAM cells; System-on-chip;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location
Hsinchu
Type
conf
DOI
10.1109/IPFA.2015.7224352
Filename
7224352
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