DocumentCode
1869253
Title
Fabrication of a novel device by release the stress in a reliable way
Author
Shuaipeng Wang ; Jinling Yang ; Yanning Chen ; Haifeng Zhang ; Dongyan Zhao
Author_Institution
NaRi Smartchip Microelectron. Technol. Co. Ltd., Beijing, China
fYear
2015
fDate
June 29 2015-July 2 2015
Firstpage
404
Lastpage
406
Abstract
Processes that define the cantilever sensor from the front side of the wafer are designed to release the stress of the buried oxide layer and top silicon layer. This approach can be applied to enhance the performance of all the cantilever-based sensors. Then, a novel cantilever array sensor was microfabricated for precise bio-marker detection.
Keywords
buried layers; cantilevers; microfabrication; micromechanical devices; sensor arrays; bio-marker detection; buried oxide layer; cantilever array sensor; cantilever-based sensors; microfabricated; top silicon layer; wafer; Adsorption; Arrays; Frequency response; Resonant frequency; Sensitivity; Silicon; Stress; MEMS; SOI precess; bio-sensor; cantilever; reliable;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location
Hsinchu
Type
conf
DOI
10.1109/IPFA.2015.7224411
Filename
7224411
Link To Document