Title :
Fabrication of a novel device by release the stress in a reliable way
Author :
Shuaipeng Wang ; Jinling Yang ; Yanning Chen ; Haifeng Zhang ; Dongyan Zhao
Author_Institution :
NaRi Smartchip Microelectron. Technol. Co. Ltd., Beijing, China
fDate :
June 29 2015-July 2 2015
Abstract :
Processes that define the cantilever sensor from the front side of the wafer are designed to release the stress of the buried oxide layer and top silicon layer. This approach can be applied to enhance the performance of all the cantilever-based sensors. Then, a novel cantilever array sensor was microfabricated for precise bio-marker detection.
Keywords :
buried layers; cantilevers; microfabrication; micromechanical devices; sensor arrays; bio-marker detection; buried oxide layer; cantilever array sensor; cantilever-based sensors; microfabricated; top silicon layer; wafer; Adsorption; Arrays; Frequency response; Resonant frequency; Sensitivity; Silicon; Stress; MEMS; SOI precess; bio-sensor; cantilever; reliable;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2015 IEEE 22nd International Symposium on the
Conference_Location :
Hsinchu
DOI :
10.1109/IPFA.2015.7224411
