DocumentCode :
1875040
Title :
Latent open testing of electronic packaging
Author :
Halperin, Arnold ; DiStefano, Thomas H. ; Chiang, Shinwu
Author_Institution :
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fYear :
1994
fDate :
15-17 Mar 1994
Firstpage :
83
Lastpage :
88
Abstract :
Alternating and direct electric currents are applied through the metal interconnections in electronic packaging to detect potential electrical opens, such as line narrowings, notches, nicks, cracks, weak connections, and interface contaminations. Due to the nonlinear relationship between the voltage across and current through the metal conductor, distorted signals are generated by the defect region as well as the good conductor. The signal generated from a latent open defect can be detected by comparing the defect signal phase with the reference phase produced by the good conductor. Application of this technique to electronic packaging development and manufacturing can improve product reliability and reduce cost by early detection of latent open defects
Keywords :
electronic equipment testing; packaging; production testing; cracks; defect signal phase; distorted signal; electronic packaging; interface contaminations; latent open testing; line narrowings; metal interconnections; nicks; notches; product reliability; reference phase; weak connections; Conductors; Contamination; Current; Electric potential; Electronic equipment testing; Electronics packaging; Nonlinear distortion; Phase detection; Signal generators; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Multi-Chip Module Conference, 1994. MCMC-94, Proceedings., 1994 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-5560-7
Type :
conf
DOI :
10.1109/MCMC.1994.292522
Filename :
292522
Link To Document :
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