Title :
High performance MCM-D technology
Author :
Kikuchi, Shunichi ; Yamamoto, Hiroshi ; Seyama, K. ; Hirano, Minoru ; Moriizumi, K.
Author_Institution :
Fujitsu Labs. Ltd., Kawasaki, Japan
Abstract :
FUJITSU has developed an MCM-D technology which uses bare chips on composite thin films for mounting CMOS chips with high density and low cost. The first use of this technology is for the K6000 Series business server. This MCM technology can be applied to a wide range of computers, from workstations to mainframes to reduce costs and improve performance. This paper focuses on the MCM packaging technology, MCM substrate technology, cooling technology and numerical analysis technique
Keywords :
cooling; integrated circuit technology; microassembling; multichip modules; numerical analysis; substrates; CMOS chip mounting; FUJITSU; MCM-D technology; bare chips; composite thin films; cooling technology; high performance MCM technology; numerical analysis technique; packaging technology; substrate technology; CMOS technology; Cooling; Copper; Costs; Packaging; Pins; Polyimides; Substrates; Transistors; Workstations;
Conference_Titel :
Multi-Chip Module Conference, 1994. MCMC-94, Proceedings., 1994 IEEE
Conference_Location :
Santa Cruz, CA
Print_ISBN :
0-8186-5560-7
DOI :
10.1109/MCMC.1994.292534
