The ARPA (ASEM) MCM brokerage service

Summary form only given, as follows. The author discusses the status of the ARPA (ASEM) sponsored MCM brokerage service at USC/ISI which interfaces system designers to domestic MCM foundries. The brokerage provides access to low cost, prototype multichip module fabrication. Comparisons are made between interfaces for ICs and MCMs to illustrate how the MOSIS Service has been extended to access MCM-D and MCM-L technologies. This is achieved through cost sharing of tooling and manufacturing along with the use of standard module sizes and packages. A “generic” sample design has been developed and is being implemented in each MCM technology. This design allows testing the interface for fabrication, assembly and test from those existing CAD tools preferred by the foundry. The design will help determine the initial price list and fabrication schedule. The set of standard module sizes has been added to the vendor´s design kits which are implemented in commercial MCM CAD tools