• DocumentCode
    1875475
  • Title

    Improved fabrication process for III–V based optical interconnects on Silicon

  • Author

    Spuesens, Thijs ; Regreny, P. ; Van Thourhout, Dries

  • Author_Institution
    INTEC Dept., Photonics Res. Group, Ghent Univ. - Imec, Ghent, Belgium
  • fYear
    2013
  • fDate
    28-30 Aug. 2013
  • Firstpage
    154
  • Lastpage
    155
  • Abstract
    We present a controllable bonding method and a self-aligned process for III-V based optical interconnects on Silicon. Optical interconnects are demonstrated with microdisk lasers with either ultra-low threshold current or record high slope efficiency.
  • Keywords
    III-V semiconductors; elemental semiconductors; integrated optoelectronics; microdisc lasers; optical fabrication; optical interconnections; silicon; III-V based optical interconnects; Si; controllable bonding method; high slope efficiency; microdisk lasers; self-aligned process; ultralow threshold current; Bonding; Detectors; Lasers; Optical interconnections; Optical waveguides; Silicon; Waveguide lasers; heterogeneous integration; microdisk laser; optical interconnect; silicon-on-insulator;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Group IV Photonics (GFP), 2013 IEEE 10th International Conference on
  • Conference_Location
    Seoul
  • ISSN
    1949-2081
  • Print_ISBN
    978-1-4673-5803-3
  • Type

    conf

  • DOI
    10.1109/Group4.2013.6644417
  • Filename
    6644417
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1875475