• DocumentCode
    187593
  • Title

    TDDB at low voltages: An electrochemical perspective

  • Author

    Muralidhar, R. ; Shaw, T. ; Chen, Fan ; Oldiges, P. ; Edelstein, D. ; Cohen, Sholom ; Achanta, Ravi ; Bonilla, G. ; Bazant, M.

  • Author_Institution
    IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
  • fYear
    2014
  • fDate
    1-5 June 2014
  • Abstract
    TDDB lifetime projections at operating voltages for backend of line (BEOL) dielectrics have been based on accelerated testing at high fields and extrapolation to operating conditions based on electric field dependent dielectric wearout models. As operating voltages are reduced to 1V range, such intrinsic field acceleration based wearout mechanisms become negligible making such extrapolations questionable. At the same time, as we scale the BEOL geometries, extrinsic wearout mechanisms involving copper and moisture can impact TDDB reliability. In this paper, we, for the first time, investigate extrinsic reliability in low voltage regime where electrochemical redox reactions are possible. We formulate a physical electrochemical model for TDDB. We present analytic solution for limiting cases that show TDDB lifetime dependence on voltage or electric field depending on relative rates of electrode reactions and field assisted ion transport. Generalization to higher voltages are also discussed.
  • Keywords
    electric breakdown; electric fields; extrapolation; life testing; low-k dielectric thin films; oxidation; reduction (chemical); reliability; BEOL dielectrics; TDDB lifetime projections; TDDB reliability; accelerated testing; backend of line; electric field; electric field dependent dielectric wearout models; electrochemical perspective; electrochemical redox reactions; electrode reactions; extrapolation; extrinsic reliability; extrinsic wearout mechanisms; field assisted ion transport; intrinsic field acceleration based wearout mechanisms; operating voltages; physical electrochemical model; ultra-low k materials; Anodes; Cathodes; Copper; Dielectrics; Equations; Moisture; Electrochemical modeling; Low-field; TDDB;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2014 IEEE International
  • Conference_Location
    Waikoloa, HI
  • Type

    conf

  • DOI
    10.1109/IRPS.2014.6861116
  • Filename
    6861116