DocumentCode
187658
Title
Frequency dependence of TDDB & PBTI with OTF monitoring methodology in high-k/metal gate stacks
Author
Bezza, Assma ; Rafik, M. ; Roy, Didier ; Federspiel, Xavier ; Mora, P. ; Ghibaudo, Gerard
Author_Institution
STMicroelectron., Crolles, France
fYear
2014
fDate
1-5 June 2014
Abstract
This paper deals with AC/DC effect on nMOS TDDB (Time Dependent Dielectric Breakdown) and PBTI (Positive Bias Temperature Instability) using suitable OTF (on the Fly) monitoring methodologies. First, an adapted unipolar AC stress without stress interruption is used to study TDDB dependences on frequency and duty cycle. For frequencies above 100Hz, Time to Breakdown is shown to depend significantly on these two parameters. On the other hand, in order to evidence a possible effect of trapping on TDDB, PBTI dependences on frequency and duty cycle are also studied using fast BTI measurement. Finally, trapping/detrapping mechanisms fail to explain TDDB observations.
Keywords
MOSFET; high-k dielectric thin films; semiconductor device breakdown; semiconductor device reliability; AC-DC effect; OTF monitoring methodology; PBTI; duty cycle; fast BTI measurement; frequency dependence; high-k-metal gate stacks; nMOS TDDB; on the fly monitoring methodology; positive bias temperature instability; time dependent dielectric breakdown; trapping-detrapping mechanisms; unipolar AC stress; Charge carrier processes; Electric breakdown; Interrupters; Logic gates; MOSFET; Reliability; Stress; High-k; Reliability; TDDB; breakdown; dielectric; metal gate; trapping;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2014 IEEE International
Conference_Location
Waikoloa, HI
Type
conf
DOI
10.1109/IRPS.2014.6861149
Filename
6861149
Link To Document