• DocumentCode
    187658
  • Title

    Frequency dependence of TDDB & PBTI with OTF monitoring methodology in high-k/metal gate stacks

  • Author

    Bezza, Assma ; Rafik, M. ; Roy, Didier ; Federspiel, Xavier ; Mora, P. ; Ghibaudo, Gerard

  • Author_Institution
    STMicroelectron., Crolles, France
  • fYear
    2014
  • fDate
    1-5 June 2014
  • Abstract
    This paper deals with AC/DC effect on nMOS TDDB (Time Dependent Dielectric Breakdown) and PBTI (Positive Bias Temperature Instability) using suitable OTF (on the Fly) monitoring methodologies. First, an adapted unipolar AC stress without stress interruption is used to study TDDB dependences on frequency and duty cycle. For frequencies above 100Hz, Time to Breakdown is shown to depend significantly on these two parameters. On the other hand, in order to evidence a possible effect of trapping on TDDB, PBTI dependences on frequency and duty cycle are also studied using fast BTI measurement. Finally, trapping/detrapping mechanisms fail to explain TDDB observations.
  • Keywords
    MOSFET; high-k dielectric thin films; semiconductor device breakdown; semiconductor device reliability; AC-DC effect; OTF monitoring methodology; PBTI; duty cycle; fast BTI measurement; frequency dependence; high-k-metal gate stacks; nMOS TDDB; on the fly monitoring methodology; positive bias temperature instability; time dependent dielectric breakdown; trapping-detrapping mechanisms; unipolar AC stress; Charge carrier processes; Electric breakdown; Interrupters; Logic gates; MOSFET; Reliability; Stress; High-k; Reliability; TDDB; breakdown; dielectric; metal gate; trapping;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2014 IEEE International
  • Conference_Location
    Waikoloa, HI
  • Type

    conf

  • DOI
    10.1109/IRPS.2014.6861149
  • Filename
    6861149