DocumentCode
1879334
Title
Modeling the die attach adhesives process
Author
Taweeplengsangsuke, J. ; Hsiung, J.-C. ; Pearson, R.A.
Author_Institution
Mater. Res. Center, Lehigh Univ., Bethlehem, PA, USA
fYear
1998
fDate
15-18 Mar 1998
Firstpage
165
Lastpage
169
Abstract
Multi-step curing was performed to reduce the residual cure stress in the polymeric adhesives. The longer the period of time at the lower temperature step of the 2-step curing gave the lower cure stress. In addition, the stress during the cool down process was investigated. At the point of decreasing temperature, the stress dramatically increases. The higher temperature difference, the larger the residual stress
Keywords
adhesion; internal stresses; microassembling; plastic packaging; thermal stresses; adhesion; bindability diagram; cool down process; die attach adhesives process; epoxy adhesives; isothermal stress; modeling; multi-step curing; polymeric adhesives; residual cure stress; Bonding; Conducting materials; Curing; Microassembly; Packaging; Polymers; Solvents; Stress; Temperature; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials, 1998. Proceedings. 1998 4th International Symposium on
Conference_Location
Braselton, GA
Print_ISBN
0-7803-4795-1
Type
conf
DOI
10.1109/ISAPM.1998.664455
Filename
664455
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