• DocumentCode
    18828
  • Title

    Effect of Packaging on Supercapacitors Strings Modeling: Proposal of Functional Unit Defined Around Balancing Circuit

  • Author

    Castano, Sandra ; Gauchia, Lucia ; Sanz-Feito, Javier

  • Author_Institution
    Electr. Eng. Dept., Carlos III Univ. of Madrid, Leganes, Spain
  • Volume
    3
  • Issue
    8
  • fYear
    2013
  • fDate
    Aug. 2013
  • Firstpage
    1390
  • Lastpage
    1398
  • Abstract
    Supercapacitors (SCs), also called electric double-layer capacitors or ultracapacitors, nowadays have a considerable applicability as fast energy storage systems. Mostly, because of its low rated voltage, they are connected in series to reach the required voltage. The most usual approach for SC strings modeling is either the simplification of the whole string to an equivalent RC network, or the concatenation of individual models. However, these approaches lose accuracy because of electrical unbalances between cells. This paper proposes a new modeling approach that defines a new grouping strategy to improve the modeling of an SC string. It implies defining the string modeling around the combination of SCs and voltage balancing circuits. The resulting model is capable of reproducing the dynamic performance of an SC string with better accuracy. Experimental validation corroborates the improved dynamic response of the proposed modeling unit.
  • Keywords
    semiconductor device models; semiconductor device packaging; supercapacitors; SC string modeling; balancing circuit; electric double-layer capacitors; electrical unbalances; energy storage systems; equivalent RC network; functional unit; grouping strategy; improved dynamic response; individual model concatenation; packaging effect; supercapacitor strings modeling; ultracapacitors; voltage balancing circuits; Capacitance; Computational modeling; Equivalent circuits; Integrated circuit modeling; Load modeling; Mathematical model; Packaging; Balancing circuit; dynamical modeling; functional unit; packaging; supercapacitors;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2013.2252956
  • Filename
    6497555