• DocumentCode
    1885649
  • Title

    Interaction of a synthetic jet with an actively cooled heat sink

  • Author

    Arik, Mehmet ; Utturkar, Yogen

  • Author_Institution
    Thermal Syst. Lab., Gen. Electr. Co. Global Res. Center, Niskayuna, NY
  • fYear
    2008
  • fDate
    28-31 May 2008
  • Firstpage
    374
  • Lastpage
    379
  • Abstract
    In high power electronics applications, the most preferred way of thermal management is the use of a heat sink and a fan for active cooling. Though this thermal solution is fairly adequate for the current heat dissipation needs, it suffers from some serious limitations, which may tend to limit its use with time. In the present study, we quantify the limitations of a conventional fan-cooled heat sink with computational models, and propose a remedy to the problem in the form of synthetic jets. Synthetic jets are meso-scale devices operating at zero-net-mass-flux principle. These devices produce periodic jet streams, which may have velocities 10-20 times greater than the average fan velocities. As a result, positioning one or more of these jets closer to the fins can cause high velocity air currents in tightly spaced fin gaps and enhance the surface heat transfer. Results of a CFD based study have been presented. Different heat sink designs are considered, and the quantification of the observed heat transfer enhancement is provided along with the underlying flow physics. It is found that synthetic jets can enhance heat transfer in excess of 2.5 times over fan cooled tight-spaced aluminum heat sinks.
  • Keywords
    aluminium; cooling; heat sinks; active cooling; actively cooled heat sink; aluminum heat sinks; flow physics; heat dissipation; heat transfer enhancement; high power electronics; meso-scale devices; surface heat transfer; synthetic jets; thermal management; zero-net-mass-flux principle; Computational fluid dynamics; Computational modeling; Electronics cooling; Energy management; Heat sinks; Heat transfer; Power electronics; Space heating; Thermal management; Thermal management of electronics; Electronics cooling; forced convection; heat sinks; synthetic jets;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on
  • Conference_Location
    Orlando, FL
  • ISSN
    1087-9870
  • Print_ISBN
    978-1-4244-1700-1
  • Electronic_ISBN
    1087-9870
  • Type

    conf

  • DOI
    10.1109/ITHERM.2008.4544294
  • Filename
    4544294