DocumentCode :
1885774
Title :
Hot electron gate current and degradation in P-channel SOI MOSFETs
Author :
Chen, J. ; Quader, K. ; Solomon, R. ; Chan, T. ; Ko, P. ; Hu, C.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
fYear :
1991
fDate :
1-3 Oct 1991
Firstpage :
8
Lastpage :
9
Abstract :
IG in P-channel SOI (silicon-on-insulator) MOSFETs is modeled and device degradation is characterized. It is found that Em is about the same as in bulk devices. The SOI devices used in this study were p+ polysilicon gate P-channel MOSFETs fabricated using a modified submicron CMOS technology on SIMOX (Separation by IMplanted OXygen) wafers. It is shown that the peak degradation of both ID and Gm occurs close to the Ig peak. This indicates that electron injection is the dominant mechanism for PMOS degradation in SOI and similar to bulk PMOS
Keywords :
hot carriers; insulated gate field effect transistors; semiconductor device models; semiconductor-insulator boundaries; PMOS degradation; SIMOX wafers; device degradation; electron injection; hot electron gate current; model; submicron CMOS technology; transconductance degradation; Contracts; Degradation; Electron devices; MOSFETs; Semiconductor films; Silicon; Solid modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference, 1991. Proceedings, 1991., IEEE International
Conference_Location :
Vail Valley, CO
Print_ISBN :
0-7803-0184-6
Type :
conf
DOI :
10.1109/SOI.1991.162830
Filename :
162830
Link To Document :
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