Set-level thermal management with package thermal design in digital TV application

Thermal resistance is the most important parameter in package selection of high power devices. However, lower thermal resistances means higher package cost, so it is not easy to adopt high cost package like cavity down packages or flip-chip packages just for the thermal characteristics. Therefore, set-level thermal management and optimal thermal guide should be done before selecting thermally enhanced packages because set-level thermal management can provide us various possibilities to get proper thermal budget. Moreover, set-level thermal management can be very powerful tool in case of digital TV application because its thermal environment is apparently different from JEDEC thermal standards (JESD51). This paper will introduce simulation methodology for optimal thermal design in set- level including package selection with experimental work in digital TV applications.