Avoiding cross talk and feed back effects in packaging coplanar millimeter-wave circuits

Author

Krems, T. ; Tessmann, A. ; Haydl, W.H. ; Schmelz, C. ; Heide, P.

Author_Institution

Fraunhofer-Inst. for Appl. Solid State Phys., Freiburg, Germany

Volume

2

fYear

1998

fDate

7-12 June 1998

Firstpage

1091

Abstract

The impact of the packaging configuration on cross talk and feed back effects caused by parasitic substrate modes is investigated for coplanar millimeter-wave circuits. It is demonstrated theoretically and by means of several circuit examples that both the mounting configuration and the thickness of the semiconductor substrate of coplanar MIMICs have to be chosen appropriately, in order to avoid circuit degradation or even failure.

Keywords

MIMIC; circuit feedback; crosstalk; flip-chip devices; integrated circuit packaging; EHF; MM-wave ICs; coplanar MIMICs; coplanar millimeter-wave circuits; crosstalk effects; dielectric carrier; feedback effects; metal package surface; mounting configuration; packaging configuration; parasitic substrate modes; semiconductor substrate thickness; Circuit stability; Conductors; Coplanar transmission lines; Degradation; Feeds; Gallium arsenide; MMICs; Millimeter wave circuits; Semiconductor device packaging; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 1998 IEEE MTT-S International

Conference_Location

Baltimore, MD, USA

ISSN

0149-645X

Print_ISBN

0-7803-4471-5

Type

conf

DOI

10.1109/MWSYM.1998.705183

Filename

705183