• DocumentCode
    1890345
  • Title

    Study on PCM Application in Old Building Energy Efficiency

  • Author

    Feng Jin-mei ; Zhu Xiang-ping ; Wang Peng ; Luo Jian-ping

  • Author_Institution
    Coll. of Urban Constr. & Safety Eng, Shanghai Inst. of Technol., Shanghai, China
  • fYear
    2013
  • fDate
    16-17 Jan. 2013
  • Firstpage
    1080
  • Lastpage
    1083
  • Abstract
    Use PCM is a way to store thermal energy on reducing the material volume and in building applications to choose the desirable phase-change temperature to reach a thermal comfort temperature. For old buildings, it is impossible to use traditional PCM as the envelope. But using a piece of PCM as a part of window maybe is a feasible choice. We have done experiments to study the PCM effects about indoor temperature and density of heat flow in Shanghai, China. The results of these experiments indicated the indoor average temperature decreased 1.67°C in the daytime and increased 1.71°C in the night, the space heat gain decreased 61% in the daytime and increased 230% in the night when PCM had used in the experimental rooms. The heat flow of PCM is the half of the glass windows in the daytime. PCM would decrease the indoor heat load in the daytime and change the thermal indoor environment in the evening. The investment payoff period is about 4 years.
  • Keywords
    building management systems; buildings (structures); energy conservation; heat transfer; indoor environment; space heating; windows (construction); China; PCM application; Shanghai; building application; glass window; heat flow density; indoor average temperature; indoor heat load; indoor temperature; material volume; old building energy efficiency; phase-change temperature; space heat gain; thermal comfort temperature; thermal energy; thermal indoor environment; Phase change materials; Space heating; Temperature measurement; Windows; Building energy efficiency; Engineering projects; Experimental study; PCM;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Measuring Technology and Mechatronics Automation (ICMTMA), 2013 Fifth International Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4673-5652-7
  • Type

    conf

  • DOI
    10.1109/ICMTMA.2013.264
  • Filename
    6493917