In-line defect detection metrology tool matching

Author

Funsten, Bill ; Ogawa, Amy ; Lui, David

Author_Institution

Adv. Micro Devices Inc., Sunnyvale, CA, USA

fYear

1997

fDate

6-8 Oct 1997

Abstract

This paper is a case study of our experience matching five darkfield defect detection tools (Inspex model 8530) used for both patterned and unpatterned wafers, in a 0.25 um and beyond development/production facility, producing both logic and memory technologies. Two of the systems were new tools and three were existing tools upgraded to identical capability. In this implementation, sensitivity, count reproducibility, defect position reproducibility, throughput, and recipe transfer from tool to tool were of major concern. This study discusses the degree of tool matching obtained as well as the lessons learned from the project approach and methodology

Keywords

inspection; integrated circuit measurement; integrated circuit yield; semiconductor process modelling; statistical process control; Inspex model 8530; count reproducibility; darkfield defect detection tools; defect position reproducibility; degree of tool matching; development/production facility; in-line defect detection; inspection recipes; metrology tool matching; patterned wafers; recipe transfer; sensitivity; throughput; tool to tool; unpatterned wafers; yield management; yield stability; Acceleration; Fabrication; Logic devices; Metrology; Monitoring; Production facilities; Reproducibility of results; Semiconductor device modeling; Stability; Throughput;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on

Conference_Location

San Francisco, CA

Print_ISBN

0-7803-3752-2

Type

conf

DOI

10.1109/ISSM.1997.664511

Filename

664511