DocumentCode
1895809
Title
Chapter 11, Thermo-mechanical issues in microelectronics and microsystems applications
fYear
2005
fDate
18-20 April 2005
Firstpage
219
Lastpage
220
Keywords
Assembly; Electronics packaging; Environmentally friendly manufacturing techniques; Lead; Microelectronics; Semiconductor device packaging; Soldering; Thermomechanical processes; Transient analysis; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN
0-7803-9062-8
Type
conf
DOI
10.1109/ESIME.2005.1502804
Filename
1502804
Link To Document