Title :
Simulation assisted investigation and improvement of the performance of an electronics assembly subjected to temperature cycling
Author :
Lindgren, Mats ; Meuwissen, Marcel ; Leisne, Peter
Author_Institution :
Kitron Dev. AB, Jonkoping, Sweden
Abstract :
Numerical simulation techniques are used increasingly in the (re-)design of micro-electronics because of their time and cost saving potentials. The current paper describes the application of such techniques for analysing and improving the thermo-mechanical performance of an electronics assembly. An initial finite element model is implemented and its predictions are compared to measurements. Based on this comparison, the model is further refined by an improved assessment of the input to the model in the form of materials properties: the properties of the moulding compound, failure behaviour of the lead-compound interface and failure behaviour of the lead material itself. Finally an updated model is used to determine directions for improvement of the behaviour of the assembly design.
Keywords :
assembling; failure analysis; finite element analysis; integrated circuit design; integrated circuit modelling; lead; lead compounds; thermomechanical treatment; Pb; electronics assembly; failure behaviour; finite element model; lead material; lead-compound interface; materials properties; microelectronics design; moulding compound; numerical simulation; performance improvement; simulation assisted investigation; temperature cycling; thermomechanical performance; Assembly; Costs; Finite element methods; Material properties; Numerical simulation; Performance analysis; Predictive models; Refining; Temperature; Thermomechanical processes;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN :
0-7803-9062-8
DOI :
10.1109/ESIME.2005.1502813
