DocumentCode :
1896391
Title :
Lateral compensation structures can break the silicon limit
Author :
Tolksdorf, C. ; SchuIze, J. ; Eisele, I. ; Deboy, G.
Author_Institution :
Inst. fur Phys., Univ. der Bundeswehr Munchen, Neubiberg, Germany
Volume :
1
fYear :
2004
fDate :
20-25 June 2004
Firstpage :
585
Abstract :
Power MOSFET design is based on solving the trade-off between breakdown voltage and on-resistance of the device. Standard vertical DMOS (Double Diffused MOS) devices show the following relation RonA∝VBD2.5 wherein the drift region determines the on-resistance. This drift region resistance can be greatly improved by superjunction devices based on the compensation principle. Compensation structures also promise for lateral power MOSFETs an immense enhancement in the relation between on-resistance and breakdown voltage. Furthermore the advantage of lateral power MOSFETs consists in the easy integration in smart-power devices. We could prove in our work that lateral compensation structures decrease the on-resistance of the drift region while preserving the breakdown voltage. Therefore it is possible to break the silicon limit.
Keywords :
MOS integrated circuits; compensation; electric resistance; silicon compounds; DMOS; breakdown voltage; device on-resistance; double diffused MOS; drift region resistance; lateral compensation structures; power MOSFET; silicon; smart-power devices; superjunction devices; Consumer electronics; Dielectric devices; Doping; Electronics cooling; Electronics industry; MOSFET circuits; Monolithic integrated circuits; Power MOSFET; Silicon; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics Specialists Conference, 2004. PESC 04. 2004 IEEE 35th Annual
ISSN :
0275-9306
Print_ISBN :
0-7803-8399-0
Type :
conf
DOI :
10.1109/PESC.2004.1355813
Filename :
1355813
Link To Document :
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