• DocumentCode
    189649
  • Title

    High-Q Lorentz force MEMS magnetometer with internal self-amplification

  • Author

    Mehdizadeh, Emad ; Kumar, Varun ; Xiaobo Guo ; Pourkamali, Siavash

  • Author_Institution
    Electr. Eng. Dept., Univ. of Texas at Dallas, Richardson, TX, USA
  • fYear
    2014
  • fDate
    2-5 Nov. 2014
  • Firstpage
    706
  • Lastpage
    709
  • Abstract
    This work presents a MEMS resonant Lorentz force magnetometer with internal self-amplification using the thermal-piezoresistive quality factor (Q) enhancement effect in silicon microstructures. Close to three orders of magnitude (~720X) improvement in sensitivity of the sensor is demonstrated by increasing the resonator bias current from 1 mA to 28 mA. Magnetometer sensitivity figure-of-merit (FOM), defined as sensitivity (mV/T) over piezoresistor bias current, has increased from 1.3Ω/T (mV/Tesla/mA) to 36.3Ω/T by amplifying resonator Q from its intrinsic value of 494 to 13,571 in air. Further amplification up to 3-4 orders of magnitude sensitivity FOM and much higher sensitivities are expected to be achievable if narrower resonator actuator beams are used. Preliminary results on the presented magnetometer show sensitivities as high as 1.01V/T (minimum detectable field in the nT range) while operating in air.
  • Keywords
    Q-factor; elemental semiconductors; force sensors; magnetic sensors; magnetometers; microsensors; silicon; Si; current 1 mA to 28 mA; high-Q Lorentz force MEMS magnetometer; internal self-amplification; magnetometer sensitivity figure-of-merit; magnitude sensitivity; silicon microstructures; thermal-piezoresistive quality factor enhancement effect; Magnetic field measurement; Magnetic resonance; Magnetoelectric effects; Magnetometers; Micromechanical devices; Sensitivity; Superconducting magnets; Lorentz force; MEMS resonator; Q enhancement; figure-of-merit (FOM); internal self-amplification; magnetometer;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SENSORS, 2014 IEEE
  • Conference_Location
    Valencia
  • Type

    conf

  • DOI
    10.1109/ICSENS.2014.6985097
  • Filename
    6985097