Title :
Transient analysis of impact fracturing of solder joints
Author :
Yeh, Chang-Lin ; Lai, Yi-Shao
Author_Institution :
Stress-Reliability Lab, Adv. Semicond. Eng., Inc., Kaohsiung, Taiwan
Abstract :
Numerical studies of transient fracturing of a package-level solder joint subjected to displacement-controlled impact loads are presented in this study. The explicit three-dimensional finite element analysis is incorporated with contact, fracturing and fragmentation mechanisms to predict transient structural responses and failure modes of the solder joint. Different strengths of the intermetallic compound, different impact velocities, and different impact angles are specified and corresponding structural responses and failure modes are investigated.
Keywords :
electronics packaging; failure analysis; finite element analysis; solders; transient analysis; 3D finite element analysis; displacement controlled impact; impact fracturing; solder joint; solder joints; transient analysis; Bonding; Electronics packaging; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Soldering; System testing; Transient analysis; Vehicle dynamics; Vehicles;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Print_ISBN :
0-7803-9062-8
DOI :
10.1109/ESIME.2005.1502857
