DocumentCode
1898043
Title
[Back cover]
fYear
2006
fDate
18-20 April 2006
Firstpage
708
Lastpage
708
Abstract
Presents the back cover of the proceedings.
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. Proceedings of the 6th International Conference on
Conference_Location
Berlin, Germany
Print_ISBN
0-7803-9062-8
Type
conf
DOI
10.1109/ESIME.2005.1502895
Filename
1502895
Link To Document