DocumentCode :
1898924
Title :
The design of a 200 mA oxygen implanter
Author :
Guerra, M.A.
Author_Institution :
Ibis Technol., Danvers, MA
fYear :
1991
fDate :
1-3 Oct 1991
Firstpage :
154
Lastpage :
155
Abstract :
A very high current oxygen implanter has been developed which is estimated to have four times the throughput capacity of presently available equipment. The design permits much greater automatic control of the process than has been possible up until now. A prototype version of the machine has been constructed. The major goals of the effort to develop a new oxygen implanter were to significantly improve the quality and consistency of SIMOX (separation by implanted oxygen) material, to increase the throughput capacity, and to reduce the eventual cost of manufacturing a SIMOX wafer
Keywords :
ion implantation; oxygen; semiconductor technology; semiconductor-insulator boundaries; 200 mA; SIMOX; Si-SiO2; automatic control; consistency improvement; cost reduction; goals; high current O2 implanter; prototype; quality improvement; throughput capacity; Automatic control; Contamination; Costs; Magnetic materials; Manufacturing; Oxygen; Prototypes; Pumps; Robots; Throughput;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference, 1991. Proceedings, 1991., IEEE International
Conference_Location :
Vail Valley, CO
Print_ISBN :
0-7803-0184-6
Type :
conf
DOI :
10.1109/SOI.1991.162903
Filename :
162903
Link To Document :
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