Title :
Optical waveguides with embedded air-gap cladding integrated within a sea-of-leads (SoL) wafer-level package
Author :
Mule, A. ; Bakir, M. ; Jayachandran, J. ; Villalaz, R. ; Reed, H. ; Agrawal, N. ; Shom Ponoth ; Plawsky, J. ; Persans, P. ; Kohl, P. ; Martin, K. ; Glytsis, E. ; Gaylord, T. ; Meindl, J.
Author_Institution :
Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
Optical waveguides are integrated into a Sea-of-Leads (SoL) wafer-level package. A photosensitive polycarbonate composite is incorporated to provide a buried air-gap cladding that allows a refractive index contrast, /spl Delta/n, between waveguide core and cladding regions of /spl Delta/n = 0.52. The final package contains 1000 electrical input/output (I/O) interconnects and 32 large-area optical waveguides for electrical chip-to-chip and optical intra-chip clock or data interconnection, respectively. Monolithic fabrication of passive optical interconnect components is described.
Keywords :
claddings; integrated circuit interconnections; integrated circuit packaging; integrated optoelectronics; optical fabrication; optical interconnections; optical waveguides; refractive index; SoL wafer-level package; buried air-gap cladding; electrical chip-to-chip interconnection; electrical input/output interconnects; large-area optical waveguides; monolithic fabrication; optical intra-chip interconnection; passive optical interconnect components; photosensitive polycarbonate composite; refractive index contrast; sea-of-leads package; Air gaps; Clocks; Integrated optics; Optical interconnections; Optical refraction; Optical variables control; Optical waveguides; Packaging; Refractive index; Wafer scale integration;
Conference_Titel :
Interconnect Technology Conference, 2002. Proceedings of the IEEE 2002 International
Conference_Location :
Burlingame, CA, USA
Print_ISBN :
0-7803-7216-6
DOI :
10.1109/IITC.2002.1014908
