Embedded micro/nano sensors for harsh engineering environments

Reliable structures and systems are critical for numerous engineering applications, e.g. manufacturing, energy conversion, and biomedical implants. These systems generally operate in harsh environments. Effective monitoring and diagnosis of these structures or the harsh environments where these structures are operating is of critical importance. Significant development of micro/nano-systems technology has occurred in recent years. However, these micro/nano-systems must survive hostile environments and provide high accuracy, long-term stability, and good reliability during service. To achieve this goal, distributed micro/nano sensors can be embedded at critical locations but without interfering the normal operation of the structures. Novel methods to fabricate and embed micro/nano thin films sensors on metal and ceramic structures will be discussed. Specifically, this paper will present two major sensor embedding methods: electroplating based sensor embedding and diffusion bonding based sensor embedding. The behavior of metal and ceramic embedded micro/nano sensors under harsh environments will be investigated. Embedded micro/nnao sensors yield great potential to numerous engineering processes.