DocumentCode :
190223
Title :
Direct determination of the volumetric heat capacity of liquids using a MEMS sensor and efficient evaluation methods
Author :
Beigelbeck, R. ; Cerimovic, S. ; Kohl, F. ; Jachimowicz, A. ; Voglhuber-Brunnmaier, T. ; Jakoby, B.
Author_Institution :
Center for Integrated Sensor Syst., Danube Univ. Krems, Wiener Neustadt, Austria
fYear :
2014
fDate :
2-5 Nov. 2014
Firstpage :
1940
Lastpage :
1943
Abstract :
In Beigelbeck et al [Meas. Sci. Technol. 22 105407, 2011], we presented a MEMS sensor containing two thin-film thermistors symmetrically arranged around a resistive heater and an associated measurement procedure to consecutively determine the thermal diffusivity and conductivity of liquids. In this contribution, we report an improved sensor design combined with two novel measurement methods featuring several distinctive advantages. First, the multi-bridge design enables up to four times faster acquisition of the required temperature-frequency response. Secondly, a newly developed AC-based measurement method facilitates direct determination of the volumetric heat capacity cV of liquids which is an essential task in many condition monitoring applications. Thirdly, a novel impulse response approach allows rapid acquisition of cV. Besides the sensor device, we present an analytical model for the basic sensing principle, both measurement methods, and sample measurements performed on selected liquids.
Keywords :
condition monitoring; microsensors; specific heat; temperature measurement; temperature sensors; thermal conductivity measurement; thermal diffusivity; thermistors; thin film sensors; transient response; AC-based measurement method; MEMS sensor; analytical model; condition monitoring applications; direct liquid volumetric heat capacity determination; impulse response approach; multibridge design; resistive heater; sample measurement; temperature-frequency response; thermal conductivity measurement; thermal diffusivity measurement; thin film thermistor; Conductivity; Heating; Liquids; Temperature measurement; Thermal conductivity; Thermistors; Volume measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SENSORS, 2014 IEEE
Conference_Location :
Valencia
Type :
conf
DOI :
10.1109/ICSENS.2014.6985411
Filename :
6985411
Link To Document :
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