Integrated micro-channel cooling in silicon

Author

Pijnenburg, R.H.W. ; Dekker, R. ; Nicole, C.C.S. ; Aubry, A. ; Eummelen, E.H.E.C.

Author_Institution

Philips Res. Eindhoven, Netherlands

fYear

2004

fDate

21-23 Sept. 2004

Firstpage

129

Lastpage

132

Abstract

Integrated micro-channel cooling, directly underneath an electronic circuit, for on-chip cooling with forced water convection has been investigated both theoretically and experimentally. In a 1-cm² experimental device, 370 W was dissipated without exceeding the critical junction temperature of 120°C at a flow rate of only 0.1 l/min and a pressure drop of 0.15 bar. The minimum thermal resistance, which is measured, is 0.08 K/W for a power dissipation of 428 W at a flow rate of 1.1 l/min. This more than satisfies the requirements for cooling of next generation CPUs.

Keywords

cooling; forced convection; integrated circuit packaging; microfluidics; thermal management (packaging); thermal resistance; 120 degC; 370 W; 428 W; CPU cooling; Si; critical junction temperature; forced water convection; integrated microchannel cooling; on-chip cooling; power dissipation; silicon microchannels; thermal resistance; Electrical resistance measurement; Electronic circuits; Electronics cooling; Etching; Power measurement; Resistance heating; Silicon; Temperature; Thermal resistance; Water heating;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Device Research conference, 2004. ESSDERC 2004. Proceeding of the 34th European

Print_ISBN

0-7803-8478-4

Type

conf

DOI

10.1109/ESSDER.2004.1356506

Filename

1356506