Title :
Wire sweep during molding of integrated circuits
Author :
Nguyen, L.T. ; Lim, F.J.
Author_Institution :
Signetics Co., Sunnyvale, CA, USA
Abstract :
The conditions that lead to wire sweep during transfer molding of plastic packages are examined. The parameters investigated include the material flow properties, the mold cavity/leadframe aspect ratio, the wire modulus, and the wire bond configuration (e.g. diameter, length, and orientation). Flow visualization with a clear silicone fluid and actual molding with an epoxy compound were carried out in order to quantify sweep conditions. A 14-lead bipolar device attached to a recessed copper leadframe and bonded with gold wires was the test vehicle. A functional relationship between the wire sweep behavior and the various processing parameters is presented
Keywords :
gold; lead bonding; packaging; Au wires; clear silicone fluid; epoxy compound; flow visualization; functional relationship; material flow properties; mold cavity/leadframe aspect ratio; plastic packages; sweep behavior; sweep conditions; transfer molding; wire bond configuration; wire modulus; wire sweep; Bonding; Copper; Gold; Plastic integrated circuit packaging; Plastic packaging; Testing; Transfer molding; Vehicles; Visualization; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 1990. ., 40th
Conference_Location :
Las Vegas, NV
DOI :
10.1109/ECTC.1990.122278
