• DocumentCode
    1903514
  • Title

    Advanced SEU engineering using a triple well architecture [CMOS SRAM]

  • Author

    Puchner, H. ; Xu, Y.Z. ; Radaelli, D.

  • Author_Institution
    Technol. R&D, Cypress Semicond., San Jose, CA, USA
  • fYear
    2004
  • fDate
    21-23 Sept. 2004
  • Firstpage
    369
  • Lastpage
    372
  • Abstract
    A triple well scheme has been implemented on an 18 Mbit fast synchronous SRAM by using a high energy implant to evaluate its impact on the alpha-particle induced accelerated soft error rate (ASER). The device uses a single poly, 0.15 μm CMOS process. The SEU performance of the test vehicle shows that the advantage of the triple well isolation and better SEU performance can only be achieved by a proper design of the wells. There is a trade off in the NMOS and PMOS region for the triple well scheme. In general, it improves in the NMOS area but degrades in the PMOS area due to the increased collection volume for holes in the PMOS area. The effectiveness of the triple well architecture depends on balancing the well design and tapping scheme trade offs.
  • Keywords
    CMOS memory circuits; SRAM chips; alpha-particle effects; ion implantation; isolation technology; radiation hardening (electronics); 0.15 micron; 18 Mbit; CMOS process; NMOS region; PMOS area hole collection volume; SEU engineering; alpha-particle induced accelerated soft error rate; fast synchronous SRAM; high energy implant; single event upset; tapping scheme; triple well architecture; triple well isolation; Acceleration; CMOS process; Degradation; Error analysis; Implants; MOS devices; Power engineering and energy; Random access memory; Testing; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Device Research conference, 2004. ESSDERC 2004. Proceeding of the 34th European
  • Print_ISBN
    0-7803-8478-4
  • Type

    conf

  • DOI
    10.1109/ESSDER.2004.1356566
  • Filename
    1356566