DocumentCode
1903514
Title
Advanced SEU engineering using a triple well architecture [CMOS SRAM]
Author
Puchner, H. ; Xu, Y.Z. ; Radaelli, D.
Author_Institution
Technol. R&D, Cypress Semicond., San Jose, CA, USA
fYear
2004
fDate
21-23 Sept. 2004
Firstpage
369
Lastpage
372
Abstract
A triple well scheme has been implemented on an 18 Mbit fast synchronous SRAM by using a high energy implant to evaluate its impact on the alpha-particle induced accelerated soft error rate (ASER). The device uses a single poly, 0.15 μm CMOS process. The SEU performance of the test vehicle shows that the advantage of the triple well isolation and better SEU performance can only be achieved by a proper design of the wells. There is a trade off in the NMOS and PMOS region for the triple well scheme. In general, it improves in the NMOS area but degrades in the PMOS area due to the increased collection volume for holes in the PMOS area. The effectiveness of the triple well architecture depends on balancing the well design and tapping scheme trade offs.
Keywords
CMOS memory circuits; SRAM chips; alpha-particle effects; ion implantation; isolation technology; radiation hardening (electronics); 0.15 micron; 18 Mbit; CMOS process; NMOS region; PMOS area hole collection volume; SEU engineering; alpha-particle induced accelerated soft error rate; fast synchronous SRAM; high energy implant; single event upset; tapping scheme; triple well architecture; triple well isolation; Acceleration; CMOS process; Degradation; Error analysis; Implants; MOS devices; Power engineering and energy; Random access memory; Testing; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Device Research conference, 2004. ESSDERC 2004. Proceeding of the 34th European
Print_ISBN
0-7803-8478-4
Type
conf
DOI
10.1109/ESSDER.2004.1356566
Filename
1356566
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