Title :
Optimization of CMP defect detection schemes [VLSI manufacture]
Author :
Swecker, Aaron L. ; Strojwas, Andrzej J. ; Xiaolei ; Levy, Ady ; Bell, Bobby
Author_Institution :
Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Abstract :
In this paper, the use of Fourier filtering in dark field defect detection is investigated for the post chemical mechanical polishing (CMP) inspection application using a simulation tool, METRO. Advanced detection techniques have been studied to determine methods of increasing capture rates in densely patterned arrays. Two critical CMP process defects, microscratches and particles, are evaluated. The results illustrate that Fourier filtering will improve the defect signal relative to the background signal. Additionally, color variation, underlying grain and pattern noise will be minimized using Fourier filtering
Keywords :
VLSI; digital simulation; electronic engineering computing; inspection; integrated circuit yield; polishing; surface contamination; surface topography; CMP defect detection schemes; Fourier filtering; METRO simulation tool; VLSI manufacture; background signal; capture rate improvement; chemical mechanical polishing; critical CMP process defects; dark field defect detection; defect signal; densely patterned arrays; microscratches; particles; pattern noise minimization; post CMP inspection; Chemicals; Electromagnetic scattering; Electromagnetic waveguides; Filtering; Lenses; Light sources; Maxwell equations; Semiconductor device modeling; Surfaces; Tungsten;
Conference_Titel :
Semiconductor Manufacturing Conference Proceedings, 1997 IEEE International Symposium on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-3752-2
DOI :
10.1109/ISSM.1997.664588
