Title :
New Corrosion Resistant Plating to Reduce Gold Consumption in Connectors
Author :
Chou, George J S
Abstract :
A new plating structure consisting of a seal layer on top of copper substrate and beneath a conventional gold/nickel finish shows excellent corrosion resistance even when using a thin gold finish for contact applications. Compared to the severe copper creep corrosion on conventional gold/nickel finishes, the new corrosion resistant plating prevents the copper creep corrosion and maintains low and stable contact resistance after 5-day mixed flowing gas (MFG) Class IIIA exposure.
Keywords :
copper; corrosion resistance; creep; electric connectors; electrical contacts; electroplating; gold; nickel; MFG class IIIA exposure; connectors; contact application; contact resistance; copper creep corrosion; copper substrate; corrosion resistant plating; gold consumption reduction; gold-nickel finish; mixed flowing gas; seal layer; Copper; Corrosion; Gold; Nickel; Resistance; Seals; Substrates;
Conference_Titel :
Electrical Contacts (Holm), 2012 IEEE 58th Holm Conference on
Conference_Location :
Portland, OR
Print_ISBN :
978-1-4673-0778-9
DOI :
10.1109/HOLM.2012.6336595
