Comparison of predicted and measured lead stiffnesses of surface mounted packages

Author

Jahsman, W.E. ; Jain, Praveen

Author_Institution

Intel Corp., Chandler, AZ, USA

fYear

1990

fDate

20-23 May 1990

Firstpage

926

Abstract

A comparison was made of predicted and measured values of lead stiffness for selected surface-mounted packages. Excellent agreement was found in all cases: 68- and 44-lead plastic leaded chip carriers (PLCCs) and cerquads (pressed ceramic quad flat pack); and 100-lead plastic quad flat packs (PQFPs). Predictions were based on the 3D elastic beam finite-element option of ANSYS, with lead geometries taken from design drawings and lead elastic properties from material specifications. Measured values were taken from straddle board test data. In these tests, the board is straddled on both sides by packages surface mounted by only their lateral or transverse leads so that lateral and transverse bending effects can be measured independently. The results point out the importance of low stiffness lead design in minimizing solder-joint deformation

Keywords

bending; finite element analysis; integrated circuit technology; surface mount technology; 3D elastic beam finite-element option; ANSYS; J-leaded package; cerquads; lateral bending effects; lead elastic properties; lead geometries; lead stiffnesses; material specifications; measured values; plastic leaded chip carriers; predicted values; pressed ceramic; quad flat pack; straddle board test data; surface mounted packages; transverse bending effects; Boundary conditions; Electronics packaging; Foot; Lead; Plastics; Predictive models; Semiconductor device measurement; Soldering; Stress; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1990. ., 40th

Conference_Location

Las Vegas, NV

Type

conf

DOI

10.1109/ECTC.1990.122300

Filename

122300