Title :
Multi Layer Metallization
Author_Institution :
LETI CEA Grenoble
fDate :
22-24 September 1997
Keywords :
Conducting materials; Conductivity; Copper; Delay; Dielectric materials; Inorganic materials; Integrated circuit interconnections; Logic; Metallization; Transistors;
Conference_Titel :
Solid-State Device Research Conference, 1997. Proceeding of the 27th European
Print_ISBN :
2-86332-221-4
DOI :
10.1109/ESSDERC.1997.194378
