DocumentCode
1908174
Title
Multi Layer Metallization
Author
Lerme, Michel
Author_Institution
LETI CEA Grenoble
fYear
1997
fDate
22-24 September 1997
Firstpage
42
Lastpage
48
Keywords
Conducting materials; Conductivity; Copper; Delay; Dielectric materials; Inorganic materials; Integrated circuit interconnections; Logic; Metallization; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Device Research Conference, 1997. Proceeding of the 27th European
Print_ISBN
2-86332-221-4
Type
conf
DOI
10.1109/ESSDERC.1997.194378
Filename
1503308
Link To Document