Electrical analysis and design of differential pairs used in high-speed flip-chip BGA packages

Author

Yuan, Weiliang ; Pang, Kuah Hsian ; Khiang, Wang Chuen ; Rue, Desmond Chong Yok ; Daengdora, Muhamad Alfian

Author_Institution

Packaging Anal. & Design Center, United Test & Assembly Center Ltd.

fYear

2006

fDate

Feb. 27 2006-March 3 2006

Firstpage

578

Lastpage

581

Abstract

In the paper, electrical analysis and design of the differential pairs used in high-speed flip-chip ball grid array (FC-BGA) packages are presented in the frequency range up to 10 GHz. The emphases are on the critical factors that determine the overall electrical performance of the differential pairs and the related packages including impedance control and the impact of discontinuities such as via and solder ball. Manufacturing tolerance is also considered in terms of characteristic impedance. The purposes of this paper are to give an insight into electrical aspects of practical differential pairs in the FC-BGA packages to speed up high-speed packaging design

Keywords

ball grid arrays; flip-chip devices; ball grid array; characteristic impedance; electrical analysis; high-speed flip-chip BGA packages; impedance control; Crosstalk; Degradation; Dielectrics; Electronics packaging; Frequency; Impedance; Microstrip; Stripline; Transmission line discontinuities; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2006. EMC-Zurich 2006. 17th International Zurich Symposium on

Conference_Location

Singapore

Print_ISBN

3-9522990-3-0

Type

conf

DOI

10.1109/EMCZUR.2006.215000

Filename

1629690