Sensitivity analysis on MEMS capacitive differential pressure sensor with bossed diaphragm membrane

Author

Eswaran, P. ; Malarvizhi, S.

Author_Institution

Dept. of Electron. & Commun. Eng., SRM Univ., Chennai, India

fYear

2012

fDate

15-16 March 2012

Firstpage

704

Lastpage

707

Abstract

This paper reports on capacitive differential pressure sensor with bossed diaphragm membranes center deflection sensitivity, capacitive sensitivity, effect of temperature on center deflection and capacitive sensitivity for the aircraft altimeter. The principle of capacitive differential pressure sensor was explained. A novel and simple diaphragm modeling and wafer bonding were proposed. This sensor is analyzed with real time parameters of pressure and temperature for aircraft flying altitude. The simulation results on deflection and capacitive sensitivity shows 0.29μm/mbar and 20aF/mbar respectively for the range of pressure.

Keywords

altimeters; avionics; capacitive sensors; microsensors; pressure sensors; sensitivity analysis; temperature; wafer bonding; MEMS capacitive differential pressure sensor; aircraft altimeter; aircraft flying altitude; bossed diaphragm membrane; capacitive sensitivity; center deflection sensitivity; diaphragm modeling; real time parameter; sensitivity analysis; temperature; wafer bonding; Electrodes; Gold; Micromechanical devices; CDPS; Capacitive pressure sensor; MEMS pressure sensor; bossed diaphragm; capacitive sensitivity; deflection sensitivity; gauge pressure packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Devices, Circuits and Systems (ICDCS), 2012 International Conference on

Conference_Location

Coimbatore

Print_ISBN

978-1-4577-1545-7

Type

conf

DOI

10.1109/ICDCSyst.2012.6188688

Filename

6188688