• DocumentCode
    1908494
  • Title

    Monolithically integrated InP-based optical pulse shaper

  • Author

    Tahvili, M.S. ; Latkowski, S. ; Leijtens, Xaveer J. M. ; Wale, M.J. ; Landais, P. ; Smit, Meint K. ; Bente, E.A.J.M.

  • Author_Institution
    COBRA Res. Inst., Tech. Univ. of Eindhoven, Eindhoven, Netherlands
  • fYear
    2013
  • fDate
    12-16 May 2013
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Spectral phase control of optical pulses is often required to generate short pulses, and an important application of a pulse shaper is spectral chirp/dispersion (pre-) compensation. In this paper, we present the pulse shaping/compression capability of a monolithically integrated optical pulse shaper. Chip fabrication has been carried out in a standardized generic photonic integration platform which is available in the framework of European FP7 project EuroPIC. A key capability of this platform is the active-passive integration scheme which allows direct integration of active components such as semiconductor optical amplifiers (SOAs) with passive elements such as arrayed waveguide gratings (AWGs) and phase modulators (PMs) on a single photonic chip.
  • Keywords
    arrayed waveguide gratings; compensation; integrated optics; optical dispersion; optical pulse compression; optical pulse shaping; phase modulation; semiconductor optical amplifiers; AWG; European FP7 project; InP; SOA; arrayed waveguide gratings; chip fabrication; monolithically integrated optical pulse shaper; passive elements; phase modulators; pulse compression; semiconductor optical amplifiers; single photonic chip; spectral chirp-dispersion compensation; spectral phase control; standardized generic photonic integration; Arrayed waveguide gratings; Chirp; Optical pulses; Optical variables measurement; Power measurement; Pulse measurements; Shape measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics Europe (CLEO EUROPE/IQEC), 2013 Conference on and International Quantum Electronics Conference
  • Conference_Location
    Munich
  • Print_ISBN
    978-1-4799-0593-5
  • Type

    conf

  • DOI
    10.1109/CLEOE-IQEC.2013.6800700
  • Filename
    6800700