Title :
Field electron emission from amorphous AlN and Cr doped AlN Films
Author :
Liao, M.Y. ; Gotoh, Y. ; Tsuji, H. ; Ishikawa, J.
Author_Institution :
Ion Beam Eng. Exp. Lab., Kyoto Univ., Japan
Abstract :
In this paper, we presented field emission properties from amorphous AlN based films, which were reactively sputter-deposited on heavily boron-doped P-Si(100) wafers at room temperature in an atmosphere of argon and nitrogen. Both undoped and Cr-doped AlN films were prepared. The characteristics of the films are studied. The doping level of Cr was controlled through changing the number of Cr sheets arranged on the Al target. The Cr concentration in the doped film was determined by Rutherford backscattering spectroscopy, and some oxygen was detected in the films due to the unclean system. X-ray diffraction measurement shows that all the films are in nearly amorphous state.
Keywords :
Rutherford backscattering; aluminium compounds; amorphous semiconductors; chromium; electron field emission; semiconductor thin films; sputtered coatings; wide band gap semiconductors; 293 to 298 K; Al target; AlN; AlN:Cr; Cr concentration; Cr doped AlN Films; Cr doping level; Rutherford backscattering spectroscopy; Si:B; X-ray diffraction; amorphous AlN; amorphous state; field electron emission; field emission properties; film properties; heavily boron-doped P-Si(100) wafers; room temperature; Amorphous materials; Argon; Atmosphere; Backscatter; Chromium; Doping; Electron emission; Nitrogen; Spectroscopy; Temperature;
Conference_Titel :
Vacuum Microelectronics Conference, 2003. Technical Digest of the 16th International
Conference_Location :
Osaka, Japan
Print_ISBN :
4-8181-9515-4
DOI :
10.1109/IVMC.2003.1223078