Wideband characterization and modeling of TAB packages using time domain techniques

Author

Su, Wansheng ; Riad, Sedki M. ; Poulin, Thomas ; Fett, Darrell ; Shen, Zhi-Yuan

Author_Institution

Dept. of Electr. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA

fYear

1990

fDate

20-23 May 1990

Firstpage

990

Abstract

A method for wideband characterization and modeling of tape automated bonding (TAB) packages using time-domain techniques is described. The method uses time-domain reflectometry data along with the modified transient circuit analysis package (MTCAP) to develop a physically based equivalent circuit model. The model accurately simulates the TAB over a wide band of frequencies (DC to >25 GHz). Computer simulations based on the model were performed to predict TAB performance parameters. Results of both the experimental measurements and computer simulations are presented

Keywords

electronic engineering computing; equivalent circuits; integrated circuit testing; microwave measurement; modelling; tape automated bonding; time-domain analysis; time-domain reflectometry; 0 to 25 GHz; MTCAP; TAB packages; computer simulations; equivalent circuit model; modeling; modified transient circuit analysis package; tape automated bonding; time-domain reflectometry data; wideband characterization; Bonding; Circuit analysis; Computational modeling; Computer simulation; Equivalent circuits; Packaging; Reflectometry; Time domain analysis; Transient analysis; Wideband;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1990. ., 40th

Conference_Location

Las Vegas, NV

Type

conf

DOI

10.1109/ECTC.1990.122308

Filename

122308