Title :
Measurement of microbump thermal resistance in 3D chip stacks
Author :
Colgan, E.G. ; Andry, P. ; Dang, B. ; Magerlein, J.H. ; Maria, J. ; Polastre, R.J. ; Wakil, J.
Author_Institution :
IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
The thermal resistance of Pb-free ~25 μm diameter microbumps with pitches of 50, 71, and 100 μm has been measured with and without underfill in four high chip stacks. With underfill, the unit thermal resistance values were 8.0, 15.5, and 19.0 C-mm2/W for 50, 71, and 100 μm pitch microbumps, respectively. The average microbump height was 16.1 microns. For the 50 μm pitch case, the thermal conduction through the underfill is roughly equal to that of the microbumps alone.
Keywords :
thermal resistance; three-dimensional integrated circuits; 3D chip stacks; average microbump height; diameter microbumps; high chip stacks; microbump thermal resistance; pitch microbumps; thermal conduction; unit thermal resistance values; Electrical resistance measurement; Semiconductor device measurement; Temperature measurement; Temperature sensors; Thermal resistance; Chip stack; Microbump; Thermal resistance;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2012 28th Annual IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4673-1110-6
Electronic_ISBN :
1065-2221
DOI :
10.1109/STHERM.2012.6188818
