Title :
Study of process-induced mechanical stresses in multi-chip modules packaged with a chip-on-board technology
Author :
Guérin, L. ; Weber, A. ; Sarbach, P. ; Dutoit, M. ; Clot, P.
Author_Institution :
Swiss Fed. Inst. of Technol., Lausanne, Switzerland
Abstract :
The chip-on-board (COB) technology offers a compact, low-cost solution to multi-chip packaging. Process-induced thermal and mechanical stresses in COB modules can affect the quality and reliability of the final product. In this paper we present an experimental and numerical study of these stresses.
Keywords :
chip-on-board packaging; circuit reliability; multichip modules; thermal stresses; COB technology; chip-on-board technology; experimental study; final product quality; final product reliability; multichip modules; multichip packaging; numerical study; process-induced mechanical stress; process-induced thermal stress; Bonding; Curing; Epoxy resins; Integrated circuit packaging; Integrated circuit technology; Polymers; Stress measurement; Temperature; Thermal stresses; Thermomechanical processes;
Conference_Titel :
Solid State Device Research Conference, 1993. ESSDERC '93. 23rd European
Conference_Location :
Grenoble
