Title :
Application of thermoelectric cooling to electronic equipment: a review and analysis
Author :
Simons, R.E. ; Chu, R.C.
Author_Institution :
Int. Bus. Machines, Poughkeepsie, NY, USA
Abstract :
This paper provides a review of thermoelectric cooling and its application to the cooling of electronic equipment. A background discussion of thermoelectric cooling is provided briefly citing early history, current developments, and the defining thermoelectric heat pumping equations. Several examples are provided of early IBM applications of thermoelectric cooling. An analysis to assess thermoelectric cooling enhancement in terms of increases in allowable power dissipation or chip temperature reduction is described along with results
Keywords :
cooling; cryogenic electronics; digital computers; reviews; thermal management (packaging); thermoelectric devices; MCM application; allowable power dissipation; chip temperature reduction; computer cooling; cooling enhancement; cooling modules; cooling power density; electronic equipment; thermal resistance; thermoelectric cooling; thermoelectric heat pumping equations; Application software; Computer aided manufacturing; Coupling circuits; Electronic equipment; Electronics cooling; Electronics packaging; History; Refrigeration; Temperature distribution; Thermoelectricity;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2000. Sixteenth Annual IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-5916-X
DOI :
10.1109/STHERM.2000.837055
