DocumentCode
1920581
Title
Stability of Copper Film Elements at the Influence of Power Electromagnetic Fields
Author
Taran, Ye.P. ; Starostenko, V.V. ; Gribs, Kiy M. ; Grygoriev, Ye.V.
Author_Institution
Tavrida Nat. Univ., Simferopol
fYear
2007
fDate
10-14 Sept. 2007
Firstpage
663
Lastpage
664
Abstract
Presented in this paper is numerical calculation of degradation processes in copper film elements at the influence of power electromagnetic fields. Character of thermal processes in non-uniform copper conducting films is established.
Keywords
conducting materials; copper; electromagnetic fields; numerical analysis; copper film elements; degradation processes; nonuniform copper conducting films; power electromagnetic fields; thermal processes; Conductive films; Copper; Electromagnetic fields; Lattices; Publishing; Semiconductor films; Silicon; Stability; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave & Telecommunication Technology, 2007. CriMiCo 2007. 17th International Crimean Conference
Conference_Location
Crimea
Print_ISBN
978-966-335-012-7
Type
conf
DOI
10.1109/CRMICO.2007.4368893
Filename
4368893
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