Title :
Through-Wafer Copper Electroplating for RF Silicon Technology
Author :
Nguyen, N.T. ; Ng, K.T. ; Boellaard, E. ; Pham, N.P. ; Craciun, G. ; Sarro, P.M. ; Burghartz, J.N.
Author_Institution :
Semiconductor Technology Researcher, Hanoi, Vietnam
fDate :
24-26 September 2002
Keywords :
Biomembranes; Copper; Electronic components; Laboratories; Lithography; Metallization; Micromachining; Radio frequency; Silicon; Wet etching;
Conference_Titel :
Solid-State Device Research Conference, 2002. Proceeding of the 32nd European
Print_ISBN :
88-900847-8-2
DOI :
10.1109/ESSDERC.2002.194918
