DocumentCode :
1923417
Title :
Electrical and Thermal Local Effects Simulation for Electromigration
Author :
Borgarino, M. ; Castagnini, A. ; De Munari, I. ; Fantini, F.
Author_Institution :
Dipartimento di Ingegneria dell´´Informazionie, UniversitÃ\xa0 di Parma, Viale delle Scienze, 43100 Parina, Italy
fYear :
1996
fDate :
9-11 Sept. 1996
Firstpage :
921
Lastpage :
924
Abstract :
This work reports on the results obtained from numerical simulations of cturrent density, temperature and temperature gradient distributions along test strtuctures designed for the evaluation of electromigration. In partictular, the thermal flux crowding effect and the conditions under which a temperature gradient peak builds up are reported. The influeilce of the bending radius of the structure is also taken into account.
Keywords :
Boundary conditions; Current density; Electromigration; Heat sinks; Laplace equations; Numerical simulation; Resistance heating; Temperature distribution; Testing; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1996. ESSDERC '96. Proceedings of the 26th European
Conference_Location :
Bologna, Italy
Print_ISBN :
286332196X
Type :
conf
Filename :
5435917
Link To Document :
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