• DocumentCode
    1925916
  • Title

    Mitigation and utilization of the inductor coupling effect in interleaved multiphase DC/DC converters

  • Author

    Wenkang Huang ; Lehman, Brad

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Northeastern Univ., Boston, MA, USA
  • fYear
    2013
  • fDate
    15-19 Sept. 2013
  • Firstpage
    1822
  • Lastpage
    1829
  • Abstract
    Interleaved multiphase synchronous buck converters have been used in powering CPU, GPU and memory due to ever increasing load current and fast load slew-rate requirements of the processors. The unwanted inductor coupling exists between adjacent phases but has not been studied systematically and has been ignored in multiphase converter designs. In some cases, the unwanted inductor coupling increases the current ripple and affects the inductor current sensing accuracy and therefore should be minimized. In other cases, the inductor coupling effect can be utilized to improve load transient response and/or converter efficiency. This paper presents magnetic simulation on three different types of inductors commonly used in multiphase converters to demonstrate the coupling effect and its influence on inductor current. The simulation results of the inductor coupling effect have been verified by experiments. Recommendations are provided to minimize the unwanted coupling effect in some designs or utilize the coupling effect in others.
  • Keywords
    DC-DC power convertors; electric sensing devices; inductors; transient response; CPU; GPU; central processing unit; current ripple; fast load slew-rate requirement; graphics processing unit; inductor coupling effect; inductor current sensor; interleaved multiphase DC-DC converter; interleaved multiphase synchronous buck converter; load current; load transient response; magnetic simulation; Central Processing Unit; Coils; Couplings; Inductance; Inductors; Magnetic cores; Transient response;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Energy Conversion Congress and Exposition (ECCE), 2013 IEEE
  • Conference_Location
    Denver, CO
  • Type

    conf

  • DOI
    10.1109/ECCE.2013.6646929
  • Filename
    6646929