• DocumentCode
    1925999
  • Title

    Tunable oxide-bypassed VDMOS (OBVDMOS): breaking the silicon limit for the second generation

  • Author

    Liang, Yung C. ; Yang, Xin ; Samudra, Ganesh S. ; Gan, K.P. ; Liu, Yong

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore
  • fYear
    2002
  • fDate
    2002
  • Firstpage
    201
  • Lastpage
    204
  • Abstract
    The research effort to lower the on-state resistance for high voltage MOSFET devices continues. We have recently reported a novel device structure termed oxide-bypassed VDMOS (OBVDMOS) that utilized the well-established oxide thickness control instead of the difficult doping control in translating the on-resistance (Ron) - blocking voltage (BVdss) tradeoff limit beyond the conventional MOSFET silicon limit. Further enhancement on both breakdown voltage and on-resistance can be achieved by applying an external bias to the poly contact of the device. Moreover, this bias provides an independent control of adjusting breakdown voltage if it does not meet specifications due to foundry process variations.
  • Keywords
    power MOSFET; semiconductor device breakdown; semiconductor device models; semiconductor device reliability; OBVDMOS; Si; blocking voltage; breakdown voltage; external bias; foundry process variations; high voltage MOSFET devices; on-state resistance; oxide thickness control; poly contact; tunable oxide-bypassed VDMOS; Contact resistance; Doping; Electrodes; Foundries; MOSFET circuits; Medical simulation; Microelectronics; Silicon; Thickness control; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and ICs, 2002. Proceedings of the 14th International Symposium on
  • Print_ISBN
    0-7803-7318-9
  • Type

    conf

  • DOI
    10.1109/ISPSD.2002.1016206
  • Filename
    1016206