DocumentCode
1925999
Title
Tunable oxide-bypassed VDMOS (OBVDMOS): breaking the silicon limit for the second generation
Author
Liang, Yung C. ; Yang, Xin ; Samudra, Ganesh S. ; Gan, K.P. ; Liu, Yong
Author_Institution
Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore
fYear
2002
fDate
2002
Firstpage
201
Lastpage
204
Abstract
The research effort to lower the on-state resistance for high voltage MOSFET devices continues. We have recently reported a novel device structure termed oxide-bypassed VDMOS (OBVDMOS) that utilized the well-established oxide thickness control instead of the difficult doping control in translating the on-resistance (Ron) - blocking voltage (BVdss) tradeoff limit beyond the conventional MOSFET silicon limit. Further enhancement on both breakdown voltage and on-resistance can be achieved by applying an external bias to the poly contact of the device. Moreover, this bias provides an independent control of adjusting breakdown voltage if it does not meet specifications due to foundry process variations.
Keywords
power MOSFET; semiconductor device breakdown; semiconductor device models; semiconductor device reliability; OBVDMOS; Si; blocking voltage; breakdown voltage; external bias; foundry process variations; high voltage MOSFET devices; on-state resistance; oxide thickness control; poly contact; tunable oxide-bypassed VDMOS; Contact resistance; Doping; Electrodes; Foundries; MOSFET circuits; Medical simulation; Microelectronics; Silicon; Thickness control; Voltage control;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and ICs, 2002. Proceedings of the 14th International Symposium on
Print_ISBN
0-7803-7318-9
Type
conf
DOI
10.1109/ISPSD.2002.1016206
Filename
1016206
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